International Flexible Packaging and Extrusions – The Daniel Siegel Memorial Scholarship

🏆 Available: 1
💰 $4,000
⏳ 02/15

Scholarship Description

Awarded only in even numbered years, the TAPPI PLACE (Polymers, Laminations, Adhesives, Coatings and Extrusions) Scholarship is designed to encourage talented science and engineering students to pursue careers in the packaging industry and to develop awareness of the industry, and of the TAPPI Polymers, Laminations, Adhesives, Coatings, and Extrusions (PLACE) Division. Membership in a TAPPI Student Chapter is required.

Eligibility Requirements

  • Type of institution award is open to: two-year college

Application Requirements

  • Application form required

How To Apply

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Donor: Technical Association of the Pulp & Paper Industry (TAPPI)

TAPPI is a registered not-for-profit, international Non-Governmental Organization of about 14,000 member engineers, scientists, managers, academics and others involved in the areas of pulp, and paper. In addition to pulp and paper, the TAPPI membership includes some allied areas of packaging.

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