Dan and Vicky Hancock Scholarship for Mechanical Engineering Excellence

🏆 Available: 1
💰 $5,500
⏳ 03/15

Scholarship Description

The Dan and Vicky Hancock Scholarship for Mechanical Engineering Excellence, established by Dan and Vicky Hancock, provides financial support for students pursuing college degrees in the field of mechanical engineering.

Eligibility

  • U.S. Resident
  • Open to all applicants – freshman through senior
  • Applicant must be planning to pursue a Mechanical Engineering degree through an ABET accredited program
  • Preference is given to students planning to attend or already attending Kettering University
  • Minimum unweighted 3.50 high school GPA for incoming freshmen; 3.0 cumulative college GPA for upperclassmen
  • Provide two (2) Letters of Recommendation – one (1) that focuses on academics and one (1) that details involvement in extra-curricular activities or employment ( It is preferred that the extra-curricular activity be related to academic degree or career intent)
  • FAFSA Form (Maximum EFC # $15,000)
  • Applicant must demonstrate service in a leadership role inside or outside of school. Applicant must be able to outline how leadership skills were developed, the size of the team(s) led, and how personal leadership skills will benefit desired future career.

Eligibility Requirements

  • Type of institution award is open to: four-year college
  • Award is available to U.S. citizens
  • Award is available to Canadian citizens
  • Award is available to citizens of countries other than the U.S. and Canada.

Application Requirements

  • Application form required
  • Transcript required
  • Test scores required
  • Essay required
  • Recommendations or references required
  • Special requirements exist (These are specified in text.)
  • FAFSA Form (Maximum EFC # $15,000)

How To Apply

Online Email

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Donor: Society of Automotive Engineers

A nonprofit engineering, educational and scientific organization dedicated to the advancement of mobility technology to better serve humanity.

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